MGP mold is mainly used in IC packaging, pot set in bottom chase, Structure of the plunger adopts quick change, Chase adopts quick change.
Applicable to DIP、 SOP、 SOT and other IC packaging, Applied to power devices & silicon bridge packaging.
| 上、下型腔偏错位≤0.038mm | Top PKG Offset : 0.038mm(MAX) |
| 塑封体中心与引线 | PKG Center To LeadFrame Center Offse : 0.038mm(MAX) |
